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MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating Symbol Value Unit
Drain−to−Source Voltage Internally Clamped VDSS 42 V
Drain−to−Gate Voltage Internally Clamped (RG = 1.0 M) VDGR 42 V
Gate−to−Source Voltage VGS ±14 V
Continuous Drain Current ID Internally Limited
Total Power Dissipation − SOT−223 Version @ TA = 25°C (Note 1)
@ TA = 25°C (Note 2)
@ TS = 25°C)
PD 1.1
1.74
8.9
W
Total Power Dissipation − DFN Version @ TA = 25°C (Note 1)
@ TA = 25°C (Note 2)
@ TS = 25°C)
PD 0.76
1.78
8.9
W
Maximum Continuous Drain Current − SOT−223 Version @ TA = 25°C (Note 1)
@ TA = 25°C (Note 2)
@ TS = 25°C)
ID 1.54
1.94
6.75
A
Maximum Continuous Drain Current − DFN Version @ TA = 25°C (Note 1)
@ TA = 25°C (Note 2)
@ TS = 25°C)
ID 1.28
1.97
6.75
A
Thermal Resistance SOT223 Junction−to−Ambient Steady State (Note 1)
SOT223 Junction−to−Ambient Steady State (Note 2)
SOT223 Junction−to−Soldering Point Steady State
DFN Junction−to−Ambient Steady State (Note 1)
DFN Junction−to−Ambient Steady State (Note 2)
DFN Junction−to−Soldering Point Steady State
RJA
RJA
RJS
RJA
RJA
RJS
114
72
14
163
70
14
°C/W
Single Pulse Drain−to−Source Avalanche Energy
(VDD = 32 V, VG = 5.0 V, IPK = 1.0 A, L = 300 mH, RG(ext) = 25 )
EAS 150 mJ
Load Dump Voltage (VGS = 0 and 10 V, RI = 2.0 , RL = 9.0 , td = 400 ms) VLD 55 V
Operating Junction Temperature TJ −40 to 150 °C
Storage Temperature Tstg −55 to 150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should
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