深圳市尚想信息技术有限公司

MJD44H11(NPN),

MJD45H11(PNP)

Complementary Power

Transistors

DPAK for Surface Mount Applications

Designed for general purpose power and switching such as output or

driver stages in applications such as switching regulators, converters,

and power amplifiers.

Features

• Lead Formed for Surface Mount Application in Plastic Sleeves

(No Suffix)

• Straight Lead Version in Plastic Sleeves (“−1” Suffix)

• Electrically Similar to Popular D44H/D45H Series

• Low Collector Emitter Saturation Voltage

• Fast Switching Speeds

• Complementary Pairs Simplifies Designs

• Epoxy Meets UL 94 V−0 @ 0.125 in

• NJV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MAXIMUM RATINGS (TA = 25C, common for NPN and PNP, minus

sign, “−”, for PNP omitted, unless otherwise noted)

Rating Symbol Max Unit

Collector−Emitter Voltage VCEO 80 Vdc

Emitter−Base Voltage VEB 5 Vdc

Collector Current − Continuous IC 8 Adc

Collector Current − Peak ICM 16 Adc

Total Power Dissipation

@ TC = 25°C

Derate above 25°C

PD

20

0.16

W

W/°C

Total Power Dissipation (Note 1)

@ TA = 25°C

Derate above 25°C

PD

1.75

0.014

W

W/°C

Operating and Storage Junction

Temperature Range

TJ, Tstg −55 to +150 °C

ESD − Human Body Model HBM 3B V

ESD − Machine Model MM C V

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. These ratings are applicable when surface mounted on the minimum pad

sizes recommended.

SILICON

POWER TRANSISTORS

8 AMPERES

80 VOLTS, 20 WATTS

IPAK

CASE 369D

STYLE 1

DPAK

CASE 369C

STYLE 1

MARKING DIAGRAMS

A = Assembly Location

Y = Year

WW = Work Week

J4xH11 = Device Code

x = 4 or 5

G = Pb−Free Package

1 2

3

4

AYWW

J4

xH11G

See detailed ordering and shipping information in the package

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